Overview

P0402FCxxC Series

The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the P0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.
0402 Flip Chip
Release Date: September 7, 2000
Rev. Date: February 22, 2018
Rev No.: 16

Electrical Characteristics

Safeguard Your Interface

Part Number Stand-off Voltage
VWM
Volts
Breakdown Voltage
V(BR)
Volts
Clamping Voltage
VC
Volts
Peak Current
IPP
Amps
Leakage Current
IR
µA
Capacitance
C
pF
Power
8x20µs
Watts
Lines
P0402FC05C5.006.0014.7017.0010.00100.002501
P0402FC08C8.008.5019.2013.0010.0075.002501
P0402FC12C12.0013.3029.709.001.0050.002501
P0402FC15C15.0016.7035.707.001.0040.002501
P0402FC24C24.0026.7055.005.001.0030.002501
P0402FC3.3C3.304.0012.5020.0075.00150.002501
P0402FC36C36.0040.0084.003.001.0025.002501